The FSA issues new guidance on plastic food packaging following an assessment from the FCMJEG, advising against ocean-bound ...

HemiClor is expected to be available in pharmacies starting in May 2025. The Food and Drug Administration (FDA) has approved HemiClor ™, a low dose formulation of chlorthalidone, for the ...

Fourteen of the 28 submitted projects have been approved, including funds for pump stations, bayou revitalization, and a stormwater management plan. The funds must be used before August 2027.

In the first quarter of this year, SCGP exported packaging products worth 1.27 billion baht to the US. Its products, worth 966 million baht, were also indirectly shipped to America via its customers.

Alongside Intel 14A, the chipmaker detailed other upcoming manufacturing processes and three new packaging technologies. “Intel is committed to building a world-class foundry that serves the ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

This alliance merges SMX's invisible molecular marking and blockchain-based platform with Aegis Packaging's O₂X™ coating technology offering a seamless way to enhance the recyclability and ...

Intel is undergoing its most sweeping transformation in decades under new CEO Lip-Bu Tan, who is steering the company away from the ambitious—but turbulent—era of Pat Gelsinger. Since taking..

Amazon These nurse-approved shoes have a breathable, sock-like upper that keeps your feet cool, wide round toes and shockproof air cushion insoles for comfort, and anti-skid outsoles for ...

"Metpack and BASF partner on Ezycompost paper for food packaging" was originally created and published by Packaging Gateway, ...

Higher education administrators said the House-approved, $50 million cut in state aid to the University System of New Hampshire (USNH) is “unsustainable” and risks tuition rate increases that ...

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of ...