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Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...
Rambus has made available complete client chipsets for next-generation AI PC memory modules with two new PMICs.
A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...
The 20th-anniversary iPhone stands to offer a major jump forward in on-device processing, with memory changes potentially ...
Apple is believed to be developing several technological innovations to mark the 20th anniversary of the iPhone, and one key ...
“Avicena’s unique technology has transformative potential for improving the bandwidth and reducing the power consumption of AI computing systems,” says Rohit Iragavarapu, Partner at Tiger Global. “We ...
Find insight on Xiaomi, Nvidia, DoorDash and more in the latest Market Talks covering Technology, Media and Telecom.
Rambus Inc. (NASDAQ: RMBS ), a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, ...
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Tom's Hardware on MSNSamsung to adopt hybrid bonding for HBM4 memorySamsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a ...
Located in Hall A on Level 1 at Booth #L1511, Advantest will showcase a wide range of solutions that address the technology ...
Samsung’s decision to increase the price for DRAM is surprising, as it may lose orders from clients, potentially decreasing ...
AMD CPUs don't currently support CUDIMM or their speed, but that should be changing within the next generation or two.
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