The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Work on the first two projects that form part of the $36 million package of work has started with the other two projects set to be carried out later this year, weather permitting. Safety improvements ...

This PDK enables the integration of the Company's advanced EO polymers into Silicon Photonic Integrated Circuits (Si-PICs) using Lightwave Logic's novel Back-End-of-Line (BEOL) process.

NEW DELHI: Homegrown optical fiber maker Sterlite Technologies (STL), along with its consortium partner Dilip Buildcon, has secured an advanced ... package 13,” BSNL said in the advance work ...