The PHY’s ... The AresCORE 16G Die-to-Die (D2D) IP implements a wide-parallel and clock forwarded PHY interface for multichannel interconnections up to 16Gbps. The PHY IP is configurable to support ...

The general purpose 22FDX® IO Library features a rich set of digital and analog IO cells covering 1.2 V to 1.8 V I/O standards and 0.4 V to 0.8 V core voltages. Diverse special function cells ...

AMD Secure Encrypted Virtualization technologies enable confidential computing by protecting virtual machines from highly privileged software such as hypervisors. In this work, we develop the first, ...

AMD's Data Center segment, driven by AI demand, is forecasted to achieve robust revenue growth, contributing to a projected 35% stock CAGR over the next three years. With a 35% margin of safety ...

Featuring the Zen 4 architecture and the AMD 3D V-Cache technology, it provides enhanced performance for gaming and creative workloads. It maintains a total of eight cores and sixteen threads ...

OIF Board Secretary/Treasurer and Physical and Link Layer (PLL) Working Group (WG) Energy Efficient Interfaces (EEI) Vice Chair (Ranovus), will moderate this panel, which will examine EEI ...

Its specs sheet proves that the processor is a high-performance chipset featuring the latest Zen 5 architecture along with high clock speeds and the 2nd gen AMD 3D V-Cache, all of which improve ...

These can include digital, analog, or mixed-signal technologies, and the whole idea is to take the optimal solution for each application and co-package them using heterogeneous integration, whether it ...

The Marvell custom AI accelerator architecture combines XPU compute silicon, HBM and other chiplets with Marvell 3D SiPho Engines on the same substrate using high-speed SerDes, die-to-die interfaces ...

State Key Laboratory of Targeting Oncology, National Center for International Research of Bio-targeting Theranostics, Guangxi Key Laboratory of Bio-targeting Theranostics, Collaborative Innovation ...

New AMD Ryzen ... from having a 3D V-Cache on both chiplets because the potential performance boost is essentially already provided by the single additional 64MB 3D V-Cache die.

IGN had a brief amount of time to benchmark AMD's upcoming Radeon RX 9070 RDNA ... is expected from Zen 5 class hardware armed with 3D-VCache). Quick "napkin math" from IGN purports that the ...