Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

Dan Gallagher is a columnist for The Wall Street Journal’s Heard on the Street, where he covers the technology and media ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management ...

SK Hynix, a key supplier of high-bandwidth memory processors to Nvidia, said quarterly profit more than doubled and demand ...