Wave and terahertz tech are reshaping RF with ultra-fast 6G, precision imaging, and sensing, driving innovation in components ...

By 2030, 1.1 billion ambient IoT devices will harness energy from light, RF, vibrations, and heat, driven by innovative new ...

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; ...

Over the past decade, the growth of passive components has been driven by smartphones. Faster communication and processing speed require more power consumption for smartphones, and therefore more ...

NXP Semiconductors now trades at a 16.5x forward P/E, where it was 24x last time I covered it in 2024. Click here to find out ...

The second-generation chips deliver much lower power ranging, higher data rates, lower latency, and greater signal robustness ...

Apple hasn’t yet introduced its new 2nm chip coming with the iPhone 18. However, TSMC already revealed it’s working on a ...

Ambient IoT' describes a new class of connected devices that can harvest energy from virtually any available source in the ...

Technology announces the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a 16V VIN buck ...

We came across a bullish thesis on Skyworks Solutions, Inc. (SWKS) on Substack by Tyler Moody. In this article, we will ...

Chiplets can bring together different die technologies together in a single package to address AI/ML applications (see figure). This is already being done but in a proprietary fashion by large OEMs ...