By 2030, 1.1 billion ambient IoT devices will harness energy from light, RF, vibrations, and heat, driven by innovative new ...

Erzia Technologies has announced a series of rf wide-band high-power amplifiers (WHPAs) that offer both broadband frequency coverage and consistent output power throughout bands as high as E-band.

The chipmaker says its new Blockscale technology will be used in an ASIC chip that will help ... s a lot of concern about power consumption and this is going to be a trend that’s pushed by ...

Ambient IoT' describes a new class of connected devices that can harvest energy from virtually any available source in the device's surrounding environment. In recent years, an ecosystem of ...

Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is ...

Shanghai, China, 5 January 2017 – Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ...