Addressing the growing use of AI and high-performance computing, JEDEC has published a new high-bandwidth memory (HBM) DRAM ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

JEDEC has announced the publication of its HBM4 standard: up to 8Gb/s across a 2048-bit memory interface, HBM4 offers up to ...

The FPGA combines HBM with DDR5 and LPDDR5 support, enabling memory bandwidth and efficiency for AI and video processing ...

SK hynix has showcased its next-gen HBM4 to the public: next-gen AI memory has up to 16-Hi stacks, 2TB/sec memory bandwidth, ...

The company warned that macroeconomic uncertainties including tariff policy have created demand volatility that will impact ...

JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for ...

SK Hynix , a key supplier of high-bandwidth memory processors to Nvidia , said quarterly profit more than doubled and demand ...

Chinese tech giant Huawei is poised to start testing its latest AI chip, which it hopes will rival products from US ...

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

Micron (MU) and SK hynix (HXSCF) will likely benefit as three of Apple's (AAPL) iPhone 17 models will incorporate more ...

The South Korean memory chip maker posted stronger-than-expected earnings for the first quarter on brisk demand for ...